metalized alumina ceramic substrate
metalized alumina ceramic substrate
metalized alumina ceramic substrate
metalized alumina ceramic substrate
metalized alumina ceramic substrate

Metalized Alumina Substrate DBC DPC Ceramic Substrate

Alumina ceramic metalized substrates are ceramic copper-clad plates with electrical conductivity, thermal conductivity, and high insulation properties, formed by metalizing alumina ceramic substrates with copper. The alumina metalized substrates can be processed through various techniques. When combined with the DBC (direct bond copper) process, they become DBC alumina ceramic copper-clad substrates. Similarly, when integrated with the DPC (direct plated copper) process, they transform into DPC alumina copper-clad substrates.

  • Brand:

    ATCERA
  • Item NO.:

    AT-DBC-C001
  • Materials

    Alumina
  • Shapes

    Substrate
  • Applications

    Semiconductor
alumina ceramic substrate

Properties of Alumina Metalized Substrate

 

1. The thermal expansion coefficient of DBC DPC alumina metalized substrates is close to that of silicon chips, eliminating the need for transition layers such as Mo sheets, thereby reducing material and processing costs.

 

2. DBC DPC alumina ceramic substrates reduce the number of solder layers, simplify packaging and assembly, lower thermal resistance, minimize voids, and enhance product yield.

 

3. Metalized alumina ceramic substrates exhibit excellent thermal conductivity and high current-carrying capacity, enabling compact chip packaging, significantly increasing power density, and improving the reliability of systems and devices.

Applications of Alumina Substrate

Applications of Alumina Metalized Substrate

 

 

Alumina metalized substratess can be applied in automotive electronics, aerospace, solar panel arrays, communication equipment, laser devices, and other fields.

 

It serves not only as carrier plates to support components but also function as heat dissipation and insulation materials. Additionally, they enable interlayer circuit interconnection, achieving superior electrical performance. They are widely used in automotive electronics, sensors, power modules, high-frequency switching power supplies, relays, communication modules, LED modules, and other applications.

Size Chart of Alumina Metalized Substrate

 

Dedicated to delivering well-performed metalized alumina substrates customized to your precise needs. Our devoted team guarantees careful adherence to your instructions, aiming to surpass customer expectations. Moreover, we provide the flexibility of tailor-made sizes to meet your unique requirements.

 

Please provide necessary parameters including the substrate dimension drawing, PCB design drawing (if etching is not required), metal material, number of layers, and thickness.

 

 

Alumina Metalized Substrate Rectangular
Item NO.

Length

(mm)

Width

(mm)

Thickness

(mm)

Thickness of

Copper Foil (mm)

Copper Coating Thickness (mm) Purity (%)
AT-DBC-C001 10 5 0.25 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C002 18 11 0.25 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C003 20 15 0.38 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C004 28 9 0.635 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C005 32 24 0.55 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C006 55 30 6 0.1-0.6 0.035 96
AT-DBC-C007 70 52 0.76 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C008 84 35 1 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C009 103 90 0.635 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C010 127 105 2 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C011 156 84 3 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C012 178 138 5 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-C013 188 138 4.6 0.1-0.6 0.075-0.1 96-99.7

 

Alumina Metalized Substrate Square
Item NO. Length (mm) Width (mm) Thickness (mm) Thickness of Copper Foil (mm) Copper Coating Thickness (mm) Purity (%)
AT-DBC-Z001 10 10 0.25 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z002 15 15 0.25 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z003 18 18 0.25 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z004 25 25 0.38 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z005 31.5 31.5 0.635 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z006 33 33 0.76 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z007 40 40 0.76 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z008 60 60 1 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z009 72 72 1 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z010 100 100 3 0.1-0.6 0.075-0.1 96-99.7
AT-DBC-Z011 127 127 1 0.1-0.6 0.035 99.7
AT-DBC-Z012 138 138 5 0.1-0.6 0.075-0.1 96-99.7

 

 

 

 

 

Specification of Aluminium Oxide Materials

Material 99% Alumina (AL2O3)
Thermal Conductivity 24.0w/m.k
Electrical Insulation ≤22.5KV, temperature resistance up to 1600℃
Density 3.83g/cm3
Thermal Expansion Coefficient 7*10-6/℃
Bending Strength (at room temperature) 310MPa
Compressive Strength (at room temperature) 2200MPa
Hardness (Hv) 1650
Fracture Toughness 4.2MPa*m1/2

 

*This chart illustrates the standard characteristics of the alumina materials commonly employed in the manufacturing of our alumina products and parts. Please be aware that the attributes of customized aluminum oxide products and parts may vary depending on the specific processes involved.

 
 

Usage Instructions

 
 
1. Metalized alumina ceramic substrates should avoid prolonged exposure to high-temperature environments and contact with organic solvents to prevent performance degradation.
 
2. Before use, inspect the surface of the substrate for scratches, cracks, or other defects and only use it after confirming its integrity.
 
3. Ensure proper connection of the metalized alumina ceramic substrate to the power source and correct grounding to prevent electrostatic damage to the substrate.

Valuable Information

 

copper-clad substrate packing

Alumina Metalized Substrate Packing

 

 

Metalized alumina substrates are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

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FAQ

Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

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In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

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