Optical Communication Modules AlN Substrate

Aluminum Nitride Substrate For Optical Communication Modules

Aluminum nitride HTCC substrate is made of aluminum nitride as raw material with accurate thickness and good densification of raw ceramic sheet, using tungsten, molybdenum, manganese and other metal slurry, and the designed circuit diagram is formed on the raw ceramic sheet through drilling, micro-hole grouting, printing and other processes, and then laminated together and sintered at 1500℃~1850℃. Finally through electroplating, brazing and other processes, a monolithic structure of three-dimensional wiring system is formed. Aluminum nitride HTCC substrate has high mechanical strength, good heat dissipation performance, high temperature and corrosion resistance, high wiring density, it 's suitable for electronic components those need to work at high temperature environment, with high thermal stability requirements and large power.

  • Brand:

    ATCERA
  • Item NO.:

    AT-GT001
  • Materials

    Aluminum Nitride (AlN) Ceramic
  • Shapes

    Substrate
  • Applications

    Semiconductor , Electronics and Electricity , Communications
Aluminum Nitride Substrate For Optical Communication Modules

Properties of Aluminum Nitride Substrate

 

This product can be used as the substrate material of ceramic thin film integrated circuit. Firstly, the ceramic multi-layer substrate is processed by HTCC process, including through hole making and internal circuit making. Then, the surface roughness can meet the requirements of thin film circuit making by polishing. Products are mainly used in the field of communication (microwave, millimeter wave communication, optical communication, radio communication), belong to customized products.

 

 

 

 

 

 

Applications of AlN Substrate

Applications of AlN Substrate

 

 

Aluminum nitride HTCC substrate is suitable for electronic components those need to work at high temperature environment, with high thermal stability requirements and large power, usually used as a high-voltage, high-power device packaging substrate, including power module, high-frequency switching power supply, relay, communication module, LED module, etc., widely used in new energy vehicles, rail transit, smart grid, aerospace and other fields.

 

 

 

 

 

 

 

 

 

 

 

 

Size Chart for Aluminum Nitride Substrate For Optical Communication Modules

We are committed to delivering prime aluminum nitride substrates tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of customized sizes to accommodate your unique requirements.

 

 

Please inquire ATCera for information or requesst.

 

 

 

 

Aluminum Nitride Substrate For Optical Communication Modules
Item no. Substrate Dimension Thickness Machinable Aperture Fine Line Resolution Surface Roughness Metal Hole Protrusion Height Direction Identifier
AT-GT001 50.8*50.8±0.15 0.2-3.0mm Φ0.008mm ≥100μm ≤0.05μm ≤3μm with
Φ0.125mm
Φ0.165mm

 

 

 

Technical Data of Aluminum Nitride Materials

AlN Type ALN-170 ALN-200
ALN-230
Density (g/cm3) 3.3 3.28 3.25
Flexture strength (MPa) 450 400 350
Young Modulus (GPa) 320 / /
Hardness (Hv) 1100 1100
1100
Fracture toughness (MPa*m1/2) 3 2.6 2.4
Maximum working temperature (℃) 1100 1100
1100
Thermal conductivity (W/m*K) 180 200
230
Thermal expansion coefficient (/℃) 4*10-6 4*10-6
4*10-6
Dielectric Constant (at 1MHz) 9 8.7
8.5
Breakdown Voltage (kV/mm) >15 >15
>15

 

*This chart illustrates the standard characteristics of the aluminum nitride materials commonly employed in the manufacturing of our AlN products and parts. Please be aware that the attributes of customized aluminum nitride products and parts may vary depending on the specific processes involved. Detailed parameter is decided by type and composition of stabilizing agent.

 

 

 

Valuable Information

 

Aluminum Nitride Substrate Packing

Aluminum Nitride Substrate Packing

 

Aluminum nitride substrates are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

 

 

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

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FAQ

Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

Absolutely. Our technical team possesses profound knowledge of ceramic materials and extensive experience in product design. We are happy to provide you with material selection advice and product design support to ensure optimal performance for your products.

We do not have a fixed minimum order value requirement. We always focus on meeting our customers' needs, and we strive to provide quality service and products regardless of the order size.

In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

Yes, we do. No matter where you are located globally, we can ensure the safe and timely delivery of your order.

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