Active metal brazing (AMB) silicon nitride substrate is a silicon nitride ceramic substrate with copper-bonded metalization, it has electrical function and high insulation properties, also with high temperature resistance, good thermal shock resistance and fast heat conductivity.AMB silicon nitride substrate is usually used as packaging substrate of high voltage, high power device, including power modules, high-frequency switching power supplies, relays, communication modules, LED modules, etc., particularly matches the third-generation semiconductor SiC power modules, which are widely used in electrical vehicles, rail transit, smart grid, aerospace and other fields.
Brand:
ATCERAItem NO.:
AT-SIN-FT1001Materials
Silicon Nitride (Si3N4) CeramicShapes
SubstrateApplications
Semiconductor , Electronics and Electricity
1. Thermal expansion coefficient of AMB silicon nitride substrate is close to that of silicon chip, with good thermal matching, which can save transition layer, reduce material and processing costs, and have high reliability of packaged components.
2. AMB silicon nitride substrate has high thermal conductivity and large current carrying capacity, which can make the chip package very compact, so that the power density is greatly improved, and the reliability of the system and device is improved.
AMB silicon nitride substrate is usually used as packaging substrate of high voltage, high power device, including power modules, high-frequency switching power supplies, relays, communication modules, LED modules, etc., particularly matches the third-generation semiconductor SiC power modules, which are widely used in electrical vehicles, rail transit, smart grid, aerospace and other fields.
We are committed to delivering optimal AMB silicon nitride substrates tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of customized sizes to accommodate your unique requirements.
The substrate diagram, PCB design diagram (not necessary if no etching request), as well as the metal material, layer number, thickness and other necessary parameters shall be provided if customized design request.
| Copper layer surface roughness | Ra≤1.5μm, Rz≤10μm, Rmax=50μm | |
| Coating layer | Nickel | 2-10μm (P6%-10%) |
| Silver | 0.1-1.0μm | |
| Nickel-gold | Ni: 2-10μm, Au: 0.01-0.15μm | |
| Nickel-gold-palladium | Ni: 2-10μm, Au: 0.01-0.15μm, Pd: 0.01-0.15μm | |
| solder mask | line width,space, tolerance | ≥0.2mm, tolerance ±0.2mm |
| poisition tolerance | ±0.2mm | |
| thickness | 5-40μm | |
| temperature change endurance | ≤320℃/10s | |
| AMB Silicon Nitride Substrate | |||
| Item No. | L*W (mm) |
Thickness of Ceramic (mm) |
Thickness of Metal (mm) |
| AT-SIN-FT1001 | 10*10~127*178 | 0.25 | 0.127, 0.2, 0.25, 0.3, 0.4, 0.5, 0.8 |
| AT-SIN-FT1002 | 0.32 | ||
| AT-SIN-FT1003 | 0.38 | ||
| AT-SIN-FT1004 | 0.63 | ||
| AT-SIN-FT1005 | 1.0 | ||
| AT-SIN-FT1006 | others | ||
| Si3N4 Type | Gas pressure sintering Si3N4 | Hot pressing sintering Si3N4 |
| Density (g/cm3) | 3.2 | 3.3 |
| Flexture strength (MPa) | 700 | 900 |
| Young Modulus (GPa) | 300 | 300 |
| Poisson's ratio | 0.25 | 0.28 |
| Compressive strength (MPa) | 2500 | 3000 |
| Hardness (GPa) | 15 | 16 |
| Fracture toughness (MPa*m1/2) | 5~7 | 6~8 |
| Maximum working temperature (℃) | 1100 | 1300 |
| Thermal conductivity (W/m*K) | 20 | 25 |
| Thermal expansion coefficient (/℃) | 3*10-6 | 3.1*10-6 |
| Thermal shock resistance (ΔT ℃) | 550 | 800 |
*This chart illustrates the standard characteristics of the silicon nitride materials commonly employed in the manufacturing of our Si3N4 products and parts. Please be aware that the attributes of customized silicon nitride products and parts may vary depending on the specific processes involved. Detailed parameter is decided by type and composition of stabilizing agent.
AMB silicon nitride substrates are carefully packaged in appropriate containers to avoid any potential damage.
1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.
2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.
3. Flexible business cooperation mechanism, support at least one piece of quantity customization.
4. Quickly provide samples and test reports to confirm that the product meets your needs.
5. Provide product use and maintenance suggestions to reduce your cost of use.
Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.
Absolutely. Our technical team possesses profound knowledge of ceramic materials and extensive experience in product design. We are happy to provide you with material selection advice and product design support to ensure optimal performance for your products.
We do not have a fixed minimum order value requirement. We always focus on meeting our customers' needs, and we strive to provide quality service and products regardless of the order size.
In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.
Yes, we do. No matter where you are located globally, we can ensure the safe and timely delivery of your order.
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